August 12, 2009, 10:09 am
Timesys announced two series of free webinars on building embedded Linux-based products using its LinuxLink service with the Texas Instruments OMAP-L137 and OMAP35xx reference platforms. The first series starts tomorrow, and focuses on TI’s OMAP-L137 Development Kit, and the second series, starting Aug. 31, uses the Zoom OMAP35x Development Kit from Logic, says the company.
Each webinar series will be delivered in three semimonthly sessions, and both series will demonstrate LinuxLink 3.0 and its Factory build system to build embedded devices, says Timesys. It’s said the webinars will include a mix of presentations and hands-on exercises that cover embedded Linux development tasks. Examples of the latter include assembling a development environment, configuring and booting an initial Linux image, customizing the kernel, and assembling a root filesystem, says the company…
